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鐳射修補(bǔ)激光器
產(chǎn)品名稱:鐳射修補(bǔ)激光器 產(chǎn)品描述:鐳射修補(bǔ)機(jī)             ... 手機(jī) 13552311591
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    鐳射修補(bǔ)機(jī)                

    項(xiàng)目                                       說明

    鐳射種類                                 ND:YAG Laser

    鐳射                                 1064nm/532nm/355nm/266nm

    鐳射功率(*大輸出)                        0.5mJ/pulse

    Peak Power                               100W

    1064波幅                                 4-6nsec

    發(fā)頻率                                 1Hz

    冷卻方法                                 風(fēng)冷式

    輸出能量控制                             1000 steps for 0-100%Hi/Low switch-able

    Flash Lamp Life time                        1年或大于10000000shots

    鐳射器保固期                              1

    介面                                     RS-232

    (實(shí)際鐳射配置規(guī)格為準(zhǔn))

     

    1 Laser Slit

          項(xiàng)目                                       說明

                                           倍率      加工尺寸

         修補(bǔ)尺寸                          NIR 50x     min: 1um x1um

                                         NIR 20x     max: 120um x 120um

     

    光學(xué)影像系統(tǒng)

    項(xiàng)目                                             說明

    顯微鏡                                        觀測(cè)/鐳射加工專用

    CCD                                          1/2Color CCD

    落射光源                                      高亮度素光源系統(tǒng)(100W)

    透射光源                                      高亮度鹵素光源系統(tǒng)(150W)

    Guide Light                                    高亮度素光源系統(tǒng)(100W)

    物鏡換系統(tǒng)                                  4/電動(dòng)()

     

    精密物鏡組

    項(xiàng)目                                           說明

    M Plan APO 5 x                                 觀察

    M Plan APO 10 x                                觀察

    M Plan NIR 20 x                                觀察/鐳射加工

    M Plan NIR 50 x                                觀察/鐳射加工

     

    自動(dòng)對(duì)焦系統(tǒng)

    項(xiàng)目                                           說明

    對(duì)焦類型                                     手動(dòng)式對(duì)焦

     

     

    加工臺(tái)

    項(xiàng)目                                           說明

    主要功能                                      工件承使用

    質(zhì)                                          精密大理石平臺(tái)

    尺寸                                          400mm x 300mm

    底座                                          大理石底座



    Features:

    All In One design removes the power supply and umbilical

    Air-cooled, Compact, No maintenance needed

    Cutting size from 1μm x 1μm (under 100X objective) to 50μm x 50μm (under 50X objective).

    Simple communication via USB or remote control box

    Precise energy control with 1000 steps

    Optional Internal CCD camera

    Internal LED or External Whitelight spot marker

    Mountable on most Failure Analysis microscopes


    Specification

    Standard Optical Energy Option  IR -1064 nm  Green -532 nm  UV3 -355 nm  UV4 -266 nm UV5 -213 nm

    Repetition Rate Single shot, 1 Hz continuous, or Burst Mode

    Spot Marker  Internal Blue LED or External Whitelight

    Communication  USB to computer/ HDMI to remote control box

    CCD Camera Optional (integrated inside the laser)

    Output Polarizer Rotation  Optional


    Environmental Requirements
    Cooling Air
    Voltage 24 VDC
    Temperature (operating) 10° – 30° C (50° – 86° F)
    Temperature (non-operating) 0° – 50° C (32° – 122° F)
    Relative Humidity 20% – 80% non-condensing
    Physical Size and Weight
    Width 6.5” / 165 mm
    Depth 3.75” / 95 mm
    Height 10.75” / 283 mm
    Weight 8.0 lbs / 3.6 kg


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